Intel to Make Custom Structured ASICs for US DoD’s DARPA

Intel and the U.S. Defense Advanced Research Projects Agency (DARPA) this week announced a three-year partnership to develop custom chips for defense systems. Under the terms of the deal, Intel will help DARPA convert currently used field-programmable gate arrays (FPGAs) into so-called structured ASICs (or eASICs), build new structured ASICs for DARPA’s needs, develop custom multi-chiplet platforms for DARPA and manufacture those new custom chips at its Fab 42 using its 10nm technology.

“We are combining our most advanced Intel eASIC structured ASIC technology with state-of-the-art data interface chiplets and enhanced security protection, and it’s all being made within the U.S. from beginning to end,” José Roberto Alvarez, senior director, CTO Office, Intel Programmable Solutions Group, said in a statement. 

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